【ivendor編輯中心 / 2025年7月30日】隨著AI運算對高效能記憶體需求激增，台灣在記憶體創新領域的重要性日益上升，仰賴其穩健的供應鏈、先進封裝技術與系統整合實力。為呼應產業趨勢，SEMICON Taiwan 2025將於9月9日在台北南港展覽館二館全新推出「記憶體高峰論壇（Memory Executive Summit）」，以「賦能AI：探索記憶體創新的無限可能」為主題，聚焦AI時代記憶體的技術突破與挑戰，從記憶體與運算晶片的協同設計，到先進封裝整合與價值鏈的全面合作。
SK hynix、Samsung、Micron三大記憶體巨頭齊聚，共塑AI時代新格局
本次高峰論壇首度邀請全球三大記憶體領導企業的高階主管同台，分享各自在AI時代的研發創新與市場前瞻觀點。討論焦點將涵蓋如高頻寬記憶體（HBM）與DDR5等次世代技術，以及驅動AI與加速運算的未來記憶體架構。
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SK hynix 副總裁 Jeff（Joonyong）Choi：剖析AI時代記憶體產業關鍵趨勢，並探討如何攜手重新定義HBM與AI運算基礎架構標準。
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Samsung電子 記憶體產品規劃副總裁 Jangseok Choi：探討次世代記憶體創新如何提升AI效能，並塑造多元演進的記憶體技術藍圖。
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Micron DRAM技術開發企業副總裁 Nirmal Ramaswamy：分享Micron如何透過突破性的DRAM技術推動AI發展，並呈現全球記憶體產業多元創新路徑。
從設計到整合，SEMICON Taiwan引領全產業對話
本次論壇將擴大涵蓋範圍，匯聚記憶體產業鏈上下游領袖，涵蓋AI晶片設計、系統整合與特定應用。台灣記憶體製造商將展現其在客製化記憶體解決方案與技術創新上的實力，針對AI浪潮下多元應用需求，提供深度洞見與動態對話，聚焦市場需求、實務應用與核心技術突破。
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聯發科資深副總裁（資料中心與AI）Anki Nalamalpu：探討領先AI晶片設計公司如何與全球合作夥伴攜手打造次世代智慧運算生態系，並定義AI時代的產業新架構。
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華邦電子總裁 陳沛銘：分享台灣記憶體業者如何於AI浪潮中建立利基技術優勢，並以客製化解決方案搶攻未來成長動能。
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旺宏電子新興研發部門主管 王克中：這位資深技術領袖將分享客製化記憶體創新如何應對AI時代多樣化應用，展現台灣企業的技術底蘊。
即日起報名享早鳥優惠至8月17日，敬請把握機會，深入了解「協同領航，創新共贏」的記憶體驅動AI新動能。詳情請參閱官方網站。
關於SEMI
SEMI®是全球半導體與電子設計與製造供應鏈的產業協會，擁有超過3,000家會員企業與150萬名專業人士。SEMI透過政策倡議、人才培育、永續發展、供應鏈管理等計畫，協助會員攜手解決產業關鍵挑戰。SEMI旗下的SEMICON展覽與活動、技術社群、標準制定與市場情報，推動會員在設計、裝置、設備、材料、服務與軟體等領域的業務成長與創新，實現更智慧、更高速、更安全的電子未來。詳情請參閱：www.semi.org，或追蹤SEMI的 Facebook、LinkedIn 與官方 LINE 帳號。
Memory Titans to Unveil Visions for Seizing the AI Lead and Driving Innovation at SEMICON Taiwan
【July 29, 2025 – Hsinchu】Amid soaring demand for high-performance memory in AI computing, Taiwan is experiencing growing prominence in memory innovation, supported by its robust supply chain, advanced packaging expertise, and system integration strengths. To meet this industry shift, SEMICON Taiwan 2025 will debut the “Memory Executive Summit” on September 9 at Taipei Nangang Exhibition Center, Hall 2. Centered on the theme “Empowering AI: Exploring the Possibilities of Memory Innovation,” the summit will spotlight breakthroughs and challenges in AI-driven memory, from co-designing memory and compute chips to integrating advanced packaging and fostering collaboration across the entire value chain.
Memory Titans SK hynix, Samsung, and Micron Share the Stage to Shape the AI Era
For the first time, the Memory Executive Summit unites top executives from the world's three leading memory industry giants on a single stage to unveil their respective AI-era R&D innovations and views on market prospects. The discussion will spotlight next-gen technologies, like High-Bandwidth Memory (HBM) and DDR5, and future memory architectures driving AI and accelerated computing.
- Jeff (Joonyong) Choi, VP of SK hynix – Examining key trends in the AI-era memory industry and partnering to redefine standards for HBM and AI computing infrastructure.
- Jangseok Choi, VP, Memory Product Planning of Samsung Electronics – Exploring how next-generation memory innovations are driving AI performance gains and shaping the diverse evolution of memory technologies.
- Nirmal Ramaswamy, Corporate VP of DRAM Technology Development, Micron – Showcasing how the company advances AI with breakthrough DRAM, spotlighting the global memory industry’s diverse innovation paths.
From Design to Integration, SEMICON Taiwan Sparks Industry-Wide Dialogue
The Summit is set to broaden its scope, bringing together industry leaders from across the memory ecosystem, spanning AI chip design, system integration, and specialized applications. Notably, Taiwanese memory manufacturers will highlight their prowess in customized memory solutions and technological innovation, addressing diverse application needs amidst the surging AI wave. Expect deep dives and dynamic dialogues from demand, real-world applications, and core technology breakthroughs.
- Anki Nalamalpu, Senior VP, Datacenter and AI of MediaTek– Focusing on how leading AI chip designers leverage global partnerships to build the next-generation smart computing ecosystem and define the new industrial framework for the AI era.
- Pei-Ming Chen, President of Winbond – Sharing how Taiwan’s memory makers are securing niche technology advantages amid the AI wave and capturing future growth through customized memory solutions.
- Keh-Chung Wang, Head of Emerging R&D of Macronix – The seasoned Macronix technology leader will share how customized memory innovations address diverse AI-era applications, showcasing the technical strengths of Taiwanese companies.
Register now and enjoy early bird discounts until August 17. Discover the momentum of memory-driven AI under the theme “Leading with Collaboration. Innovating with the World.” For more details:
Official Website.
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