圖片來源: CIIF大會提供
【ivendor編輯中心 / 2026年08月25日】作為第 26 屆中國國際工業博覽會（CIIF 2026）的旗艦主題展之一，2026 國際半導體生態展（ICES 2026）正式定於 2026 年 10 月 12 日至 16 日在中國上海國家會展中心 5.2 館舉行。作為亞太地區領先的半導體盛會，ICES 2026 將匯聚頂尖半導體企業、技術創新者、設備供應商與終端工業用戶，共同推動跨界合作，加速「芯智融合」。
以應用為導向，貫通端到端產業鏈價值
ICES 2026 打破傳統僅按產品類別劃分的展示方式，圍繞真實的工業應用場景展開。展會重點呈現符合工業級高可靠性、車規級標準，以及面向 AI 與具身智能應用的技術方案，實現從核心晶片到工業終端應用的全閉環。作為國家級戰略平台與全球半導體樞紐，ICES 全面貫通了從晶片設計、晶圓製造到先進封裝、關鍵設備及下游系統整合的完整產業鏈。
五大專題展區，促進生態鏈協同創新
ICES 2026 設立五大專業展區，全面促進全產業鏈協同與商業轉化：
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積體電路設計展區：重點展示 EDA 工具與平台、IP 核、IC 設計服務，以及高效能運算（HPC）處理器、記憶體晶片、電源管理晶片（PMIC）與功率半導體等核心晶片方案。
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晶圓製造展區：集中呈現邏輯與特色工藝平台、IDM 與記憶體製造、化合物半導體製造及智慧晶圓廠建設。
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封裝測試展區：呈現晶圓級封裝（WLP）、系統級封裝（SiP）等先進封裝技術，並涵蓋車載電子與 MEMS 專用封裝、高效能檢測分析及玻璃基板等次世代工藝。
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半導體設備與材料展區：展出光刻、蝕刻、薄膜沉積、清洗、CMP 等晶圓製造核心設備，以及量測與檢測系統、化合物半導體專用設備、矽晶圓、光阻劑、電子特氣與關鍵零組件。
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應用與系統整合展區：匯集產業龍頭終端企業，全面展示覆蓋 AI 基礎設施、具身智能、智慧網聯汽車、智慧家電與穿戴裝置的「晶片 + 嵌入式」解決方案。
高規格峰會與專業技術論壇
除了靜態展示外，ICES 2026 還將打造涵蓋旗艦高峰會、10 餘場專業技術論壇及高層社交活動的三層級會議體系。會議將匯聚政府代表、全球產業領袖、技術專家與投資機構，深度剖析政策走向、技術趨勢與市場動態。與會嘉賓將圍繞車規級半導體突破、先進記憶體技術、具身智能與工業機器人發展，以及次世代先進封裝與生態協同等核心議題展開深入交流。
共赴上海，共建全球半導體創新生態
作為展覽面積達 30 萬平方米、覆蓋從基礎材料、核心零組件到尖端製造設備全產業鏈的工博會（CIIF）重要組成部分，ICES 2026 是技術交流、新品首發與精準商業對接的核心平台。
目前，CIIF 2026 與國際半導體生態展（ICES）的觀眾預登記通道已正式開啟。誠摯邀請全球工業從業者、專業採購商與技術供應商於今年 10 月相聚上海，共同開拓市場新機遇，引領智慧製造新未來。
觀眾預登記連結：https://www.ciif-expo.cn/ciifVisitor/AudienceEn/ExchSelect?registrationCode=MKT-MKT-pr-ices
IC Ecosystem Show (ICES) 2026 to Drive Application-Led Innovation at CIIF in Shanghai
The IC Ecosystem Show (ICES 2026), one of the flagship theme shows of the 26th China International Industry Fair (CIIF 2026), is officially scheduled to take place from October 12 to 16, 2026, in Hall 5.2 at the National Exhibition and Convention Center (Shanghai), China. Serving as a premier semiconductor exhibition in the Asia-Pacific region, ICES 2026 will gather top semiconductor companies, technology innovators, equipment suppliers, and industrial end-users to drive cross-border collaboration and accelerate chip-intelligence convergence.
Mapping an End-to-End Industry Value Chain Driven by Applications
Rather than presenting products by category alone, ICES 2026 is organized around real-world industrial applications. The exhibition showcases technologies selected specifically for industrial-grade reliability, automotive-grade compliance, and AI applications and embodied intelligence, closing the loop from core chips to industrial scenarios. Acting as a national strategic platform and global semiconductor hub, ICES connects the complete value chain—from design and wafer fabrication to advanced packaging, equipment, and downstream system integration.
Five Dedicated Exhibition Zones for Ecosystem Synergy
ICES 2026 features five specialized exhibition zones designed to foster ecosystem-wide synergy and commercialization. The journey begins in the Integrated Circuit Design Zone, showcasing EDA tools and platforms, IP cores, IC design services, and core chip solutions, including HPC processors, memory chips, power management ICs (PMICs), and power semiconductors. Moving along the manufacturing ecosystem, the Wafer Fabrication Zone highlights logic and specialty process platforms, IDM and memory manufacturing, compound semiconductor manufacturing, and smart fab facilities. To complement this, the Packaging & Testing Zone presents advanced packaging technologies such as Wafer-Level Packaging (WLP) and System-in-Package (SiP), alongside specialized packaging for automotive electronics and MEMS, high-performance inspection and analysis, and next-generation processes like glass substrates.
Furthermore, trade visitors exploring the Semiconductor Equipment & Materials Zone will discover core wafer fab equipment—including lithography, etching, thin-film deposition, cleaning, and CMP—as well as metrology and inspection systems, compound-semiconductor tools, silicon wafers, photoresists, electronic specialty gases, and key subsystems. Finally, the Application & System Integration Zone brings together leading end-user enterprises to showcase "Chip + Embedded Solutions" across AI infrastructure, Embodied AI, intelligent vehicles, smart home appliances, and wearable electronics.
High-Level Summit & Specialized Technical Forums
Alongside the static exhibition, ICES 2026 will host a comprehensive three-tier conference program, including a flagship industry summit, over 10 specialized technical forums, and exclusive executive networking events. Bringing together government officials, global industry executives, technology experts, and investors, the program will deeply explore policy developments, technology trends, and market dynamics. Attendees will have the opportunity to engage in critical tracks focusing on the latest breakthroughs in automotive semiconductors, advanced memory technologies, the rapid evolution of embodied AI and industrial robotics, and the future of next-generation IC packaging and ecosystem integration.
Join the Global Semiconductor Ecosystem in Shanghai
As a vital part of CIIF 2026 — a 300,000-square-meter mega-event showcasing the complete smart and sustainable manufacturing supply chain including foundational materials, key components, cutting-edge manufacturing equipment and solutions — ICES 2026 serves as an essential platform for technical exchange, product debuts, and precision business matchmaking.
Visitor pre-registration for CIIF 2026 and the IC Ecosystem Show (ICES) is now officially live. Industrial professionals, trade buyers, and global technology providers are cordially invited to gather in Shanghai this October to unlock new market opportunities and shape the future of smart manufacturing.
Visitor pre-registration: https://www.ciif-expo.cn/ciifVisitor/AudienceEn/ExchSelect?registrationCode=MKT-MKT-pr-ices
